Evaluation Diffusion Coefficient and Thermal Conductivity for Epoxy –nTiO2
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Author:
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FADHIL FARHAN
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Abstract:
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In this study, thermal analyzer (thermal conductivity, effiusivity, diffusivity, heat capacity and thermal resistance), have been studied for (epoxy polymer, reinforced with nano silicon carbide( 0vol %, 3vol%, 5vol%, 7vol% and 10%). Ultrasonic dispersion technique used to prepare the nanocomposites specimens follow with cold – casting technique using flash Teflon molds standard conditions. Mathis TC i technique is used to measure thermal conductivity analyze. Thermal analyzer (thermal conductivity, thermal effusively and thermal diffusion) results show that values increase by succession of volume fraction of fillers. Heat capacity and thermal resistance results show that values decrease progressively by succession of volume fraction of fillers. Scanning electron microscopy used were employed to aid interpretation results of thermal analyzer and distribution nanoparticle in base – matrix.
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Keyword:
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effiusivity thermal, diffusivity thermal, epoxy, Nanocomposites
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EOI:
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DOI:
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